PCBs feem ntau yog tsim los ntawm cov khoom siv substrate thiab cov ntawv ci tooj liab. Cov ntaub ntawv sib txawv ncaj qha cuam tshuam rau PCB qhov kev ua tau zoo ntawm hluav taws xob, hluav taws xob dissipation, mechanical zog, thiab kev ua haujlwm ib puag ncig. Tam sim no, cov khoom siv dav tshaj plaws yog FR-4, cov khoom sib xyaw ua los ntawm fiberglass daim ntaub thiab epoxy resin. Nws muaj cov rwb thaiv tsev zoo heev, tiv thaiv tshav kub, thiab lub zog txhua yam, thaum tseem yog tus nqi nruab nrab, ua rau nws siv dav hauv computer motherboards, kev tswj hwm kev lag luam, cov khoom siv hluav taws xob, thiab cov khoom siv hluav taws xob. FR-4 kuj muaj kev ua haujlwm zoo, ua tau raws li cov kev xav tau ntawm ntau txheej PCBs thiab cov xaim hluav taws xob siab, ua rau nws yog PCB feem ntau hauv kev lag luam hluav taws xob.
Cov khoom siv thiab cov txheej txheem kho saum npoo ntawm cov ntawv ci tooj liab ntawm PCB nto yog qhov tseem ceeb sib npaug. Copper foil feem ntau muab faib ua electrolytic tooj liab thiab dov tooj liab; ntau hom cuam tshuam cov conductivity thiab yooj ntawm circuitry. Txhawm rau txhim kho solderability thiab oxidation tsis kam, PCB nto tau ua cov txheej txheem xws li tin plating, immersion kub, immersion nyiaj, thiab OSP (Optically Solderable Precision). Immersion kub muab siab flatness thiab muaj zog corrosion kuj, ua rau nws haum rau siab -precision thiab siab- kev ntseeg siab ntawm cov khoom siv hluav taws xob; tin plating, ntawm qhov tod tes, tsis tshua kim thiab feem ntau siv hauv kev tsim khoom ntawm cov khoom siv hluav taws xob zoo tib yam. Raws li kev lag luam hluav taws xob hloov mus rau qhov nrawm dua, qhov me me, thiab kev ntseeg siab dua, cov ntaub ntawv PCB tseem tau hloov kho tas li kom tau raws li qhov xav tau ntawm daim ntawv thov ntau dua.
